Swann Technologies

Technical Specifications

Document Ref: ST-PRD-094 // Rev C

Export-Control Aware
Defense-Ready Process

PCB Fabrication Capabilities

Parameter Standard Tolerance Advanced Capability
Layer Count Typical project range Project-dependent
Min. Trace/Space Project-dependent Advanced coordination
Min. Mechanical Drill Project-dependent Advanced coordination
Min. Laser Drill (Microvia) Project-dependent Advanced coordination
Aspect Ratio (TH) Project-dependent Advanced coordination
Impedance Control Project-dependent Advanced coordination
Max Panel Size Project-dependent Advanced coordination

SMT Assembly Tolerances

  • Min. Passive Size Project-dependent
  • Min. BGA Pitch Project-dependent
  • Placement Accuracy Project-dependent
  • Inspection As required

Qualified Materials

FR-4 (High Tg) Tg 170°C - 210°C
Rogers / PTFE 4003C, 4350B, RT/duroid
Polyimide Rigid-Flex / Flex
Metal Core (MCPCB) Aluminum, Copper Base

Mission-Critical Reliability Planned In.